Applied Materials introduces three new chipmaking systems
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Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge AI Performance
October 7, 2025 8:30 AM UTCKinex is the industrys first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera system enables higher performance Gate-All-Around transistors at 2nm and beyond by depositing void-free, uniform epitaxial layersPROVision 10 eBeam metrology system improves yield of complex 3D chips by providing sub-nanometer resolution, fast throughput and deep imaging
SANTA CLARA, Calif., Oct. 07, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new semiconductor manufacturing systems that boost the performance of advanced logic and memory chips foundational to AI... More
