Applied Materials introduces three new chipmaking systems

Applied Materials Inc. (NASDAQ: AMAT) announced three new semiconductor manufacturing systems designed to enhance advanced logic and memory chip production for AI computing applications.

The company introduced the Kinex bonding system, developed in collaboration with BE Semiconductor Industries N.V., which represents the industry's first integrated die-to-wafer hybrid bonding system. The system combines all critical hybrid bonding process steps into one platform and is currently being used by logic, memory and outsourced semiconductor assembly customers.

Applied Materials also unveiled the Centura Xtera Epi system, which addresses challenges in creating Gate-All-Around transistors at 2nm and beyond. The system features a low-volume chamber architecture with integrated pre-clean and etch processes, achieving 50 percent lower gas usage than conventional epitaxial systems and providing more than 40 percent improvement in cell-to-cell uniformity.

The third product, the PROVision 10 eBeam metrology system, targets complex 3D chip manufacturing. The system incorporates cold field emission technology, increasing nanoscale image resolution by up to 50 percent and imaging speed by up to 10 times compared to conventional thermal field emission technology. Multiple logic and memory chipmakers are using the system.

"As chips become more complex, Applied is focused on driving materials engineering breakthroughs to provide the performance and power-efficiency improvements needed to scale AI," said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials.

The systems target three areas in AI chip development: Gate-All-Around transistors for logic applications, high-bandwidth memory for DRAM, and advanced packaging for integrated systems. Applied Materials will discuss these innovations at SEMICON West 2025.

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