Applied Materials launches six new systems for DRAM and AI chip packaging
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Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
June 25, 2026 9:00 AM EDTInnovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM fabs adds a critical logic-class stepboosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logicNew eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present
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