Intel appoints Seok-Hee Lee as EVP to lead advanced packaging
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Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
June 18, 2026 4:31 PM EDTSANTA CLARA, Calif.--(BUSINESS WIRE)-- Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intels ability to deliver differentiated, system-level innovation for customers.
Seok-Hee Lee Appointed to Lead Advanced Packaging
As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This reflects the growing importance and complexity... More
