Coherent launches bondable diamond thermal management solutions
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Coherent Expands Thermal Management Portfolio with High-Performance Bondable Diamond Solutions
January 19, 2026 4:05 PM ESTSAXONBURG, Pa., Jan. 19, 2026 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced the launch of its state-of-the-art Bondable Diamond solutions for thermal management: a diamond solution engineered with a specialized surface finish that enables direct bonding to semiconductor die for electronic and opto-electronic applications. By eliminating or dramatically reducing thermal interface resistance, bondable diamond significantly improves device cooling performance.
Coherents bondable diamond features precisely controlled surface roughness, flatness, coatings, and preparation, enabling direct bonding to semiconductor materials including silicon, silicon carbide, gallium nitride, aluminum gallium nitride, gallium... More
