Qnity launches integrated materials platform for advanced chip packaging

Qnity Electronics, Inc. (NYSE: Q) has introduced a materials solution platform that combines metallization, bumping, dielectric, and fine-line patterning technologies targeting high-density and 3D integrated semiconductor systems, according to a company statement.

The platform is designed to support advanced packaging formats including Chip-on-Wafer-on-Substrate (CoWoS), Embedded Multi-die Interconnect Bridge (EMIB), and high-bandwidth memory (HBM). Qnity says the portfolio enables 2 µm line/space metallization with tight critical dimension control and supports tin-silver micro-bumps, copper-to-copper direct and hybrid bonding, and high-resolution dielectric and patterning processes.

Key products within the platform include the Intervia CB1000+/CB3000 copper series for within-die uniformity, the Solderon TS8000 solder series for HBM micro-bump plating, the Riston WBR5000 dry film photoresist for 2.5D packaging with film thickness ranging from 200 to 320 µm, and the Cyclotene dry film photo-imageable dielectric for fan-out panel-level packaging and glass core substrates.

"Customers are looking for system-level solutions," said Chuck Xu, President of Interconnect Solutions at Qnity. "Our teams serve as a design partner with end-to-end process development and engineering capabilities that help customers solve the integration complexity layer-to-layer, chip-to-chip, and scale new designs with confidence."

Qnity plans to present details of the platform at the Heterogeneous Integration Global Summit during SEMICON Taiwan 2026 on Sept. 1, with a presentation by Jason Chuang, Packaging Polymer Segment Director. The company will also be present at booth S7930 in the Materials Pavilion at TaiNEX 2.

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