Entegris wins patent rulings in Taiwan and China over CMP slurry

Entegris, Inc. (Nasdaq: ENTG) said courts in Taiwan and China upheld two of its patents covering colloidal silica slurry technology used in chemical mechanical planarization (CMP) semiconductor manufacturing processes, according to a company press release.

On July 14, 2026, the Taiwan Intellectual Property and Commercial Court rejected a challenge by an affiliate of Qnity Electronics, Inc. and upheld Taiwan Patent No. I561622. On August 10, 2026, China's National Intellectual Property Administration rejected a separate challenge by a Qnity affiliate and upheld Chinese Patent No. 107075343B. Both patents relate to acidic colloidal silica slurry technology.

The rulings follow earlier enforcement actions involving the same patent family. In 2021, the U.S. International Trade Commission found that Qnity's Optiplane CMP slurry products infringed U.S. Patent No. 9,499,721 and issued exclusion and cease and desist orders barring the importation, marketing, and sale of those products in the United States. In 2024, Entegris resolved related U.S. district court litigation over the same products. The exclusion and cease and desist orders remain in force until 2035.

"These decisions reinforce the strength of our intellectual property and our commitment to protecting the innovations that differentiate Entegris, strengthen our competitive position, and support long-term value creation for customers and shareholders," said Olivier Blachier, President of Materials Solutions and Senior Vice President and Chief Innovation Officer at Entegris.

You May Also Be Interested In

• Qatar Investment Authority targets $20B partnership with JPMorgan - Bloomberg
• HP Inc. projects mid-single-digit PC market decline in 2027
• Oura files for 50M share IPO at $40-$44/sh