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Form 4 Qnity Electronics, Inc. For: Aug 31 Filed by: CURTIN TERRENCE R

Wed, 02 Sep 2026 17:39:00 -0400

si-local-file:///var/storage/secattach/20260902/27020313.html

Form 4 Qnity Electronics, Inc. For: Aug 31 Filed by: CURTIN TERRENCE R

Wed, 02 Sep 2026 17:39:00 -0400

si-local-file:///var/storage/secattach/20260902/27020313.html

Form 4 Qnity Electronics, Inc. For: Aug 31 Filed by: Green Byron

Wed, 02 Sep 2026 17:38:00 -0400

si-local-file:///var/storage/secattach/20260902/27020311.html

Form 4 Qnity Electronics, Inc. For: Aug 31 Filed by: Green Byron

Wed, 02 Sep 2026 17:38:00 -0400

si-local-file:///var/storage/secattach/20260902/27020311.html

Qnity launches Stackplane CMP slurry line for advanced packaging

Mon, 31 Aug 2026 06:30:57 -0400

Qnity Electronics, Inc. (NYSE: Q) has introduced the Stackplane™ family of slurries for chemical mechanical planarization (CMP), targeting advanced semiconductor packaging applications, according to a company statement.

The Stackplane™ platform includes both commercialized products and next-generation slurry technologies designed to address multiple CMP steps required in advanced packaging, including planarization following hybrid bonding and through-silicon via (TSV) integration. The product line is organized into four series:

— SP1000 and SP2000 series for hybrid bonding
— SP3000 series for TSV applications
— SP4000 series for polymer CMP
— SP5000 series for emerging technologies, including panel-level through-glass vias and glass CMP

"Advanced packaging is creating

Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging

Mon, 31 Aug 2026 06:30:00 -0400

Supporting the transition to ‘shrink–and–stack' as part of Qnity's end-to-end advanced packaging portfolio

WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260831678857/en/

A scientist evaluates the performance of Stackplane™ CMP slurry in Qnity's polishing lab in Hsinchu, Taiwan. Qnity's Stackplane™ CMP slurries
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<h1>Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging</h1>
<p>Mon, 31 Aug 2026 06:30:00 -0400</p>
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Supporting the transition to ‘shrink–and–stack' as part of Qnity's end-to-end advanced packaging portfolio

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260831678857/en/

Integrated portfolio spans metallization, bumping, dielectric and fine-line patterning for 2.5D, 3D and panel-level architectures

WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems. The platform enables AI-driven advanced packaging, where finer interconnects, higher density, and improved manufacturing yields determine whether a design can successfully scale.

"Customers are looking for system-level solutions, and that's where Qnity shines,” said Chuck Xu, President, Interconnect

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

Tue, 25 Aug 2026 06:30:00 -0400

Integrated portfolio spans metallization, bumping, dielectric and fine-line patterning for 2.5D, 3D and panel-level architectures

"Customers are looking for system-level solutions, and that's where Qnity shines,” said Chuck Xu, President, Interconnect

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

Tue, 25 Aug 2026 06:30:00 -0400

Integrated portfolio spans metallization, bumping, dielectric and fine-line patterning for 2.5D, 3D and panel-level architectures

"Customers are looking for system-level solutions, and that's where Qnity shines,” said Chuck Xu, President, Interconnect

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

Tue, 25 Aug 2026 06:30:00 -0400

Integrated portfolio spans metallization, bumping, dielectric and fine-line patterning for 2.5D, 3D and panel-level architectures

"Customers are looking for system-level solutions, and that's where Qnity shines,” said Chuck Xu, President, Interconnect

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

Fri, 21 Aug 2026 16:30:00 -0400

WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will have a fireside chat at the 2026 Goldman Sachs Communacopia and Technology Conference on September 10, at 8:10am PST.

A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclusion of the event.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

Fri, 21 Aug 2026 16:30:00 -0400

A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclusion of the event.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

Fri, 21 Aug 2026 16:30:00 -0400

A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclusion of the event.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

Fri, 21 Aug 2026 16:30:00 -0400

A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclusion of the event.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance

Form 8-K Qnity Electronics, Inc. For: Aug 21

Fri, 21 Aug 2026 07:10:00 -0400

si-local-file:///var/storage/secattach/20260821/26958431.html

Form 8-K Qnity Electronics, Inc. For: Aug 21

Fri, 21 Aug 2026 07:10:00 -0400

si-local-file:///var/storage/secattach/20260821/26958431.html

Qnity Electronics names Ken Rizvi as CFO, effective October 1

Fri, 21 Aug 2026 07:06:13 -0400

Qnity Electronics, Inc. (NYSE: Q) has appointed Ken Rizvi as Senior Vice President and Chief Financial Officer, effective October 1, according to a press release from the company.

Rizvi brings more than 25 years of financial experience in the semiconductor industry. He most recently served as CFO of Synaptics, a publicly traded semiconductor company, where he oversaw global finance, corporate development, investor relations, and IT. Before that, he held the CFO role at Smart Global Holdings, now known as Penguin Solutions, and has also served as CFO at UTAC Group in Singapore and Isola Group. Earlier in his career, he held

Qnity Electronics names Ken Rizvi as CFO, effective October 1

Fri, 21 Aug 2026 07:06:13 -0400

Qnity Electronics, Inc. (NYSE: Q) has appointed Ken Rizvi as Senior Vice President and Chief Financial Officer, effective October 1, according to a press release from the company.

Qnity Electronics names Ken Rizvi as CFO, effective October 1

Fri, 21 Aug 2026 07:06:13 -0400

Qnity Electronics, Inc. (NYSE: Q) has appointed Ken Rizvi as Senior Vice President and Chief Financial Officer, effective October 1, according to a press release from the company.

Qnity Electronics names Ken Rizvi as CFO, effective October 1

Fri, 21 Aug 2026 07:06:13 -0400

Qnity Electronics, Inc. (NYSE: Q) has appointed Ken Rizvi as Senior Vice President and Chief Financial Officer, effective October 1, according to a press release from the company.

Qnity Appoints Semiconductor Finance Veteran Ken Rizvi Chief Financial Officer

Fri, 21 Aug 2026 07:05:00 -0400

WILMINGTON, Del.--(BUSINESS WIRE)-- Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1. Michael Goss, who has been serving as interim Chief Financial Officer, will assume the role of Qnity’s Vice President, Finance and Controllership, at that time.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819407944/en/

Ken Rizvi, Senior Vice President and
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<h1>Qnity Appoints Semiconductor Finance Veteran Ken Rizvi Chief Financial Officer</h1>
<p>Fri, 21 Aug 2026 07:05:00 -0400</p>
<p> WILMINGTON, Del.--(BUSINESS WIRE)--
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1. Michael Goss, who has been serving as interim Chief Financial Officer, will assume the role of Qnity’s Vice President, Finance and Controllership, at that time.

</p><p id=

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819407944/en/