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   <title>Lam Research (LRCX) call put ratio 1.9 calls to 1 put into quarter results</title>
   <link>http://www.streetinsider.com/Options/Lam+Research+%28LRCX%29+call+put+ratio+1.9+calls+to+1+put+into+quarter+results/27214929.html</link>
   <description>&lt;p&gt;Lam Research (NASDAQ: LRCX) October 23 weekly call option implied volatility is at 124, November is at 64; compared to its 52-week average of 43 to 101. Call put ratio 1.9 calls to 1 put into the expected release of quarter results today after the bell.&lt;/p&gt;</description>
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   <pubDate>Wed, 21 Oct 2026 11:05:54 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Lam Research (LRCX) call put ratio 1.9 calls to 1 put into quarter results</title>
   <link>http://www.streetinsider.com/Option+EPS+Action/Lam+Research+%28LRCX%29+call+put+ratio+1.9+calls+to+1+put+into+quarter+results/27214929.html</link>
   <description>&lt;p&gt;Lam Research (NASDAQ: LRCX) October 23 weekly call option implied volatility is at 124, November is at 64; compared to its 52-week average of 43 to 101. Call put ratio 1.9 calls to 1 put into the expected release of quarter results today after the bell.&lt;/p&gt;</description>
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   <pubDate>Wed, 21 Oct 2026 11:05:54 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Lam Research (LRCX) call put ratio 1 call to 1 put into quarter results</title>
   <link>http://www.streetinsider.com/Options/Lam+Research+%28LRCX%29+call+put+ratio+1+call+to+1+put+into+quarter+results/27208799.html</link>
   <description>&lt;p&gt;Lam Research (NASDAQ: LRCX) October 23 weekly call option implied volatility is at 110, November is at 64; compared to its 52-week average of 43 to 101. Call put ratio 1 call to 1 put into the expected release of quarter results after the bell on October 21.&lt;/p&gt;</description>
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   <pubDate>Tue, 20 Oct 2026 11:03:53 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Lam Research (LRCX) call put ratio 1 call to 1 put into quarter results</title>
   <link>http://www.streetinsider.com/Option+EPS+Action/Lam+Research+%28LRCX%29+call+put+ratio+1+call+to+1+put+into+quarter+results/27208799.html</link>
   <description>&lt;p&gt;Lam Research (NASDAQ: LRCX) October 23 weekly call option implied volatility is at 110, November is at 64; compared to its 52-week average of 43 to 101. Call put ratio 1 call to 1 put into the expected release of quarter results after the bell on October 21.&lt;/p&gt;</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Option+EPS+Action/Lam+Research+%28LRCX%29+call+put+ratio+1+call+to+1+put+into+quarter+results/27208799.html</guid>
   <pubDate>Tue, 20 Oct 2026 11:03:53 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Lam Research (LRCX) PT Lowered to $338 at B.Riley</title>
   <link>http://www.streetinsider.com/Analyst+PT+Change/Lam+Research+%28LRCX%29+PT+Lowered+to+%24338+at+B.Riley/27201417.html</link>
   <description>B.Riley analyst Craig Ellis lowered the price target on Lam Research (NASDAQ: LRCX) to $338.00  (from $390.00) while maintaining a Buy rating.</description>
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   <pubDate>Mon, 19 Oct 2026 08:59:30 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Lam Research (LRCX) PT Raised to $375 at Deutsche Bank</title>
   <link>http://www.streetinsider.com/Analyst+PT+Change/Lam+Research+%28LRCX%29+PT+Raised+to+%24375+at+Deutsche+Bank/27200732.html</link>
   <description>Deutsche Bank analyst Melissa Weathers raised the price target on Lam Research (NASDAQ: LRCX) to $375.00  (from $320.00) while maintaining a Buy rating.</description>
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   <pubDate>Mon, 19 Oct 2026 07:43:03 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Lam Research drops amid AI spending slowdown fears</title>
   <link>http://www.streetinsider.com/Investing/Lam+Research+drops+amid+AI+spending+slowdown+fears/27191577.html</link>
   <description>&lt;p&gt;Lam Research shares fell 6.7% in morning trading Thursday as a selloff across the semiconductor equipment sector deepened. The decline marked the eighth consecutive session of losses for the stock, wiping out approximately $75 billion in market value during that period.&lt;/p&gt;&lt;p&gt;The semiconductor equipment sector faces mounting concern that AI-related capital expenditure, which drove equipment orders throughout 2026, may be slowing. Equipment manufacturers sell to fabrication plants based on planned capacity expansion rather than current chip production, making them vulnerable to shifts in spending plans.&lt;/p&gt;&lt;p&gt;The concerns began after Anthropic's CEO publicly advocated for slower AI model development. Applied Materials added to</description>
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   <pubDate>Thu, 15 Oct 2026 10:21:16 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/AI/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Analyst+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Hot+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/AI/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Analyst+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Hot+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/AI/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Analyst+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Hot+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/AI/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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  <item>
   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Analyst+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">ONTO</category>
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   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Hot+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
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   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">ONTO</category>
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  <item>
   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/AI/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
   <guid isPermaLink="true">http://www.streetinsider.com/AI/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</guid>
   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">KLAC</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">ONTO</category>
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  <item>
   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Analyst+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Analyst+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</guid>
   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">ASML</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">KLAC</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">ONTO</category>
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  <item>
   <title>RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'</title>
   <link>http://www.streetinsider.com/Hot+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</link>
   <description>&lt;p&gt;RBC: 'we continue to see a clear path to double-digit WFE growth through 2028'.&lt;/p&gt;&lt;p&gt;The analyst comments &quot;We expect HBM base die migration to advanced logic nodes to continue given the need for faster pin speeds, lower power, and the integration of memory controller and other custom functionality. Samsung has already transitioned to 4nm, and we won't be surprised if SKHY/MU adopt advanced nodes for HBM4E (custom versions, if not the standard versions). Our analysis suggests that potential base die migration at SKHY/MU could drive 50–90k wafers (WSPM) of additional advanced- node capacity, or ~$30B in incremental WFE spending, compared to</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Hot+Comments/RBC%3A+%27we+continue+to+see+a+clear+path+to+double-digit+WFE+growth+through+2028%27/27175366.html</guid>
   <pubDate>Mon, 12 Oct 2026 16:19:33 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">ONTO</category>
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   <title>Key things to focus on as chipmakers prepare to present at 2026 SEMICON West</title>
   <link>http://www.streetinsider.com/Hot+List/Key+things+to+focus+on+as+chipmakers+prepare+to+present+at+2026+SEMICON+West/27174837.html</link>
   <description>&lt;p&gt;In a recent note to clients, Citi analysts told investors that component availability is emerging as the key investor topic heading into the SEMICON West conference in San Francisco, which runs from Oct. 13 to 15.&lt;/p&gt;&lt;p&gt;The bank maintained its bull case for wafer fab equipment spending of $163 billion in 2026, $224 billion in 2027 and $286 billion in 2028. However, it cautioned investors against raising expectations further because of supply chain readiness.&lt;/p&gt;&lt;p&gt;The bank said shortages of DRAM memory, capacitors, circuit boards and optical components are now affecting some equipment makers, creating a potential bottleneck in the very tools used</description>
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   <pubDate>Mon, 12 Oct 2026 10:41:59 -0400</pubDate>
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   	   	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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  <item>
   <title>Key things to focus on as chipmakers prepare to present at 2026 SEMICON West</title>
   <link>http://www.streetinsider.com/Hot+List+Pro/Key+things+to+focus+on+as+chipmakers+prepare+to+present+at+2026+SEMICON+West/27174837.html</link>
   <description>&lt;p&gt;In a recent note to clients, Citi analysts told investors that component availability is emerging as the key investor topic heading into the SEMICON West conference in San Francisco, which runs from Oct. 13 to 15.&lt;/p&gt;&lt;p&gt;The bank maintained its bull case for wafer fab equipment spending of $163 billion in 2026, $224 billion in 2027 and $286 billion in 2028. However, it cautioned investors against raising expectations further because of supply chain readiness.&lt;/p&gt;&lt;p&gt;The bank said shortages of DRAM memory, capacitors, circuit boards and optical components are now affecting some equipment makers, creating a potential bottleneck in the very tools used</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Hot+List+Pro/Key+things+to+focus+on+as+chipmakers+prepare+to+present+at+2026+SEMICON+West/27174837.html</guid>
   <pubDate>Mon, 12 Oct 2026 10:41:59 -0400</pubDate>
      	<category domain="http://rss.financialcontent.com/stocksymbol">AMAT</category>
   	   	<category domain="http://rss.financialcontent.com/stocksymbol">LRCX</category>
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   <title>Key things to focus on as chipmakers prepare to present at 2026 SEMICON West</title>
   <link>http://www.streetinsider.com/Hot+List/Key+things+to+focus+on+as+chipmakers+prepare+to+present+at+2026+SEMICON+West/27174837.html</link>
   <description>&lt;p&gt;In a recent note to clients, Citi analysts told investors that component availability is emerging as the key investor topic heading into the SEMICON West conference in San Francisco, which runs from Oct. 13 to 15.&lt;/p&gt;&lt;p&gt;The bank maintained its bull case for wafer fab equipment spending of $163 billion in 2026, $224 billion in 2027 and $286 billion in 2028. However, it cautioned investors against raising expectations further because of supply chain readiness.&lt;/p&gt;&lt;p&gt;The bank said shortages of DRAM memory, capacitors, circuit boards and optical components are now affecting some equipment makers, creating a potential bottleneck in the very tools used</description>
   <guid isPermaLink="true">http://www.streetinsider.com/Hot+List/Key+things+to+focus+on+as+chipmakers+prepare+to+present+at+2026+SEMICON+West/27174837.html</guid>
   <pubDate>Mon, 12 Oct 2026 10:41:59 -0400</pubDate>
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