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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Showcases+Industry-Leading+Solutions+for+Scaling+AI+Infrastructure+at+OFC+2026/26153302.html</link>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <pubDate>Thu, 12 Mar 2026 16:15:00 -0400</pubDate>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Showcases+Industry-Leading+Solutions+for+Scaling+AI+Infrastructure+at+OFC+2026/26153302.html</link>
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&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <pubDate>Thu, 12 Mar 2026 16:15:00 -0400</pubDate>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Showcases+Industry-Leading+Solutions+for+Scaling+AI+Infrastructure+at+OFC+2026/26153302.html</link>
   <description>
&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <pubDate>Thu, 12 Mar 2026 16:15:00 -0400</pubDate>
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   <title>Broadcom Showcases Industry-Leading Solutions for Scaling AI Infrastructure at OFC 2026</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Showcases+Industry-Leading+Solutions+for+Scaling+AI+Infrastructure+at+OFC+2026/26153302.html</link>
   <description>
&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) -- &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=ebyMP5KZkXwat9dgcuLITjlN1xEPHy0YqXW72o5GIWG0Y7oCB8WgpME__XQo7uZ6Wl4y94jt9QKtdj-xqVZb4Uu4uqwlwsEnUAAWREn-fGY=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Broadcom Inc.&lt;/a&gt; (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the expansion of its open, scalable, and power-efficient AI infrastructure portfolio for gigawatt-scale AI clusters. These industry-leading solutions – including the 3.5D XPU, 102.4T Ethernet switch with co-packaged optics (CPO), 400G/lane optical DSP, 200G/lane Ethernet retimers and AEC, and PCIe Gen6 switches and retimers – will be showcased at the &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=3BPAHW9uxO_2HhPRjv3KeAtNS3m0DNvNZ0OJFG3xl8w4rWk6Zj35phH-M5SGMWBeJzA5Nq0-f9wxWx5lI7roGXYaNxDkCqhGhWvwNmD_Q6vSqql7hJ1X7yllLjy6tbY6KmRJH7znznFlY_w4IRRLLcIDSO25qf4Pwxk5z9uVCuc=&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;2026 Optical Fiber Communications Conference and Exhibition (OFC)&lt;/a&gt; from March 15-19 in Los Angeles.</description>
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   <title>Broadcom ships Tomahawk 6 switch with 102.4 Tbps throughput</title>
   <link>http://www.streetinsider.com/Corporate+News/Broadcom+ships+Tomahawk+6+switch+with+102.4+Tbps+throughput/26152741.html</link>
   <description>&lt;p&gt;Broadcom Inc. (NASDAQ: AVGO) announced that its Tomahawk 6 family switch series has entered production volume shipments. The company stated the switch delivers 102.4 terabits per second throughput, which it described as double the capacity of its predecessor, the Tomahawk 5.&lt;/p&gt;&lt;p&gt;According to the company, the Tomahawk 6 moved from initial samples to production deployment in less than three quarters. The switch is designed for AI infrastructure networks used for training and inference applications.&lt;/p&gt;&lt;p&gt;The Tomahawk 6 supports both 100G and 200G SerDes configurations and includes features for load balancing and congestion management. Broadcom stated the switch can support AI clusters with</description>
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   <pubDate>Thu, 12 Mar 2026 16:00:46 -0400</pubDate>
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   <title>Broadcom Now Shipping World’s First 102.4 Tbps Switch in Production Volume</title>
   <link>http://www.streetinsider.com/Press+Releases/Broadcom+Now+Shipping+World%E2%80%99s+First+102.4+Tbps+Switch+in+Production+Volume/26152726.html</link>
   <description>
&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) --  Broadcom Inc. (NASDAQ: AVGO), a global leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that the Tomahawk® 6 family switch series is now shipping in production volume. Unprecedented for a chip of its scale, Tomahawk 6 moved rapidly from initial samples to production deployment.&lt;/p&gt;  &lt;p&gt;“Broadcom’s ability to take Tomahawk 6 to production in less than three quarters from initial sampling is a testament to its innovation at scale,” said Asad Khamisy, senior vice president and general manager, Core Switching Group, Broadcom. “Tomahawk</description>
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   <pubDate>Thu, 12 Mar 2026 16:00:00 -0400</pubDate>
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   <title>Broadcom Now Shipping World’s First 102.4 Tbps Switch in Production Volume</title>
   <link>http://www.streetinsider.com/Press+Releases/Broadcom+Now+Shipping+World%E2%80%99s+First+102.4+Tbps+Switch+in+Production+Volume/26152726.html</link>
   <description>
&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) --  Broadcom Inc. (NASDAQ: AVGO), a global leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that the Tomahawk® 6 family switch series is now shipping in production volume. Unprecedented for a chip of its scale, Tomahawk 6 moved rapidly from initial samples to production deployment.&lt;/p&gt;  &lt;p&gt;“Broadcom’s ability to take Tomahawk 6 to production in less than three quarters from initial sampling is a testament to its innovation at scale,” said Asad Khamisy, senior vice president and general manager, Core Switching Group, Broadcom. “Tomahawk</description>
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   <pubDate>Thu, 12 Mar 2026 16:00:00 -0400</pubDate>
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   <title>Broadcom Now Shipping World’s First 102.4 Tbps Switch in Production Volume</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Now+Shipping+World%E2%80%99s+First+102.4+Tbps+Switch+in+Production+Volume/26152726.html</link>
   <description>
&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) --  Broadcom Inc. (NASDAQ: AVGO), a global leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that the Tomahawk® 6 family switch series is now shipping in production volume. Unprecedented for a chip of its scale, Tomahawk 6 moved rapidly from initial samples to production deployment.&lt;/p&gt;  &lt;p&gt;“Broadcom’s ability to take Tomahawk 6 to production in less than three quarters from initial sampling is a testament to its innovation at scale,” said Asad Khamisy, senior vice president and general manager, Core Switching Group, Broadcom. “Tomahawk</description>
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   <title>Broadcom Now Shipping World’s First 102.4 Tbps Switch in Production Volume</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Now+Shipping+World%E2%80%99s+First+102.4+Tbps+Switch+in+Production+Volume/26152726.html</link>
   <description>
&lt;p&gt;PALO ALTO, Calif., March  12, 2026  (GLOBE NEWSWIRE) --  Broadcom Inc. (NASDAQ: AVGO), a global leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that the Tomahawk® 6 family switch series is now shipping in production volume. Unprecedented for a chip of its scale, Tomahawk 6 moved rapidly from initial samples to production deployment.&lt;/p&gt;  &lt;p&gt;“Broadcom’s ability to take Tomahawk 6 to production in less than three quarters from initial sampling is a testament to its innovation at scale,” said Asad Khamisy, senior vice president and general manager, Core Switching Group, Broadcom. “Tomahawk</description>
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   <title>Form  10-Q       Broadcom Inc.             For: Feb 01</title>
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   <pubDate>Wed, 11 Mar 2026 16:44:00 -0400</pubDate>
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   <title>Form  10-Q       Broadcom Inc.             For: Feb 01</title>
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   <title>Broadcom launches 400G/lane optical DSP for AI data centers</title>
   <link>http://www.streetinsider.com/Corporate+News/Broadcom+launches+400Glane+optical+DSP+for+AI+data+centers/26143588.html</link>
   <description>&lt;p&gt;Broadcom Inc. (NASDAQ: AVGO) announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus BCM83640, designed for 1.6T transceiver solutions. The chip enables optical transceiver manufacturers to produce low-power 1.6T pluggable modules for AI data centers.&lt;/p&gt;&lt;p&gt;The monolithic 3nm device features integrated laser driver technology and supports optical modules from 1.6T to 3.2T. The company states the product complies with IEEE and OIF standards and supports LR links on the chip-to-module electrical interface.&lt;/p&gt;&lt;p&gt;The 400G/lane technology doubles bandwidth per optical lane compared to 200G/lane architectures. 1.6T pluggable modules using the Taurus BCM83640 enable 102.4T switching capacity in a 1RU system,</description>
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   <pubDate>Wed, 11 Mar 2026 09:02:34 -0400</pubDate>
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   <title>Broadcom Delivers Industry’s First 400G/lane Optical DSP for Next-Generation AI Networks</title>
   <link>http://www.streetinsider.com/Press+Releases/Broadcom+Delivers+Industry%E2%80%99s+First+400Glane+Optical+DSP+for+Next-Generation+AI+Networks/26143515.html</link>
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&lt;p&gt;PALO ALTO, Calif., March  11, 2026  (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus™ BCM83640, optimized for 1.6T transceiver solutions with unprecedented bandwidth density and efficiency. The device features 400G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost effectively deliver low power 1.6T pluggable modules to meet the growing bandwidth needs for AI data centers.&lt;/p&gt;  &lt;p&gt;&lt;strong&gt;Taurus™ BCM83640 Product Highlights&lt;/strong&gt;&lt;/p&gt;  &lt;ul type=&quot;disc&quot;&gt;&lt;li style=&quot;margin-top:12pt;&quot;&gt;Monolithic 3nm 1.6T (8:4) PAM-4 DSP with</description>
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   <pubDate>Wed, 11 Mar 2026 09:00:00 -0400</pubDate>
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   <title>Broadcom Delivers Industry’s First 400G/lane Optical DSP for Next-Generation AI Networks</title>
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&lt;p&gt;PALO ALTO, Calif., March  11, 2026  (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus™ BCM83640, optimized for 1.6T transceiver solutions with unprecedented bandwidth density and efficiency. The device features 400G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost effectively deliver low power 1.6T pluggable modules to meet the growing bandwidth needs for AI data centers.&lt;/p&gt;  &lt;p&gt;&lt;strong&gt;Taurus™ BCM83640 Product Highlights&lt;/strong&gt;&lt;/p&gt;  &lt;ul type=&quot;disc&quot;&gt;&lt;li style=&quot;margin-top:12pt;&quot;&gt;Monolithic 3nm 1.6T (8:4) PAM-4 DSP with</description>
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   <pubDate>Wed, 11 Mar 2026 09:00:00 -0400</pubDate>
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   <title>Broadcom Delivers Industry’s First 400G/lane Optical DSP for Next-Generation AI Networks</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Delivers+Industry%E2%80%99s+First+400Glane+Optical+DSP+for+Next-Generation+AI+Networks/26143515.html</link>
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&lt;p&gt;PALO ALTO, Calif., March  11, 2026  (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus™ BCM83640, optimized for 1.6T transceiver solutions with unprecedented bandwidth density and efficiency. The device features 400G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost effectively deliver low power 1.6T pluggable modules to meet the growing bandwidth needs for AI data centers.&lt;/p&gt;  &lt;p&gt;&lt;strong&gt;Taurus™ BCM83640 Product Highlights&lt;/strong&gt;&lt;/p&gt;  &lt;ul type=&quot;disc&quot;&gt;&lt;li style=&quot;margin-top:12pt;&quot;&gt;Monolithic 3nm 1.6T (8:4) PAM-4 DSP with</description>
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   <pubDate>Wed, 11 Mar 2026 09:00:00 -0400</pubDate>
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   <title>Broadcom Delivers Industry’s First 400G/lane Optical DSP for Next-Generation AI Networks</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Broadcom+Delivers+Industry%E2%80%99s+First+400Glane+Optical+DSP+for+Next-Generation+AI+Networks/26143515.html</link>
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&lt;p&gt;PALO ALTO, Calif., March  11, 2026  (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced the availability of its 3nm 400G/lane optical PAM-4 DSP, the Taurus™ BCM83640, optimized for 1.6T transceiver solutions with unprecedented bandwidth density and efficiency. The device features 400G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost effectively deliver low power 1.6T pluggable modules to meet the growing bandwidth needs for AI data centers.&lt;/p&gt;  &lt;p&gt;&lt;strong&gt;Taurus™ BCM83640 Product Highlights&lt;/strong&gt;&lt;/p&gt;  &lt;ul type=&quot;disc&quot;&gt;&lt;li style=&quot;margin-top:12pt;&quot;&gt;Monolithic 3nm 1.6T (8:4) PAM-4 DSP with</description>
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   <pubDate>Wed, 11 Mar 2026 09:00:00 -0400</pubDate>
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