Axcelis Announces Sponsorship and Participation in the 25th International Conference on Ion Implantation and Annealing Technology 2026
At the event, Axcelis will host a company exhibit in Booth #7 and the company's technologists and collaborators will present on the following topics:
Implant Innovation
- Purion XEmax™ for SiC Superjunction MOSFETs
- Purion H6™ Next Generation High Current Implanter
- Improving SiC MOSFET Within-Wafer Implant Uniformity Through an Integrated CIP
- Remote Vaporizer for Al Implantation in SiC
Enabling SiC Manufacturing Excellence
- Impact of Stacking Density on SiC Implant Profiles
- High-Energy Al Channeling Implant Characterization
- Aluminum Ion Implantation Beam Current & Performance Improvement
Implant Platform Developments
- Realtime Beam Shape Monitor
- Beam Energy Measurement System
- Wafer Backside Particle Reduction
- Low-Cost High Current Metal Ion Source
Emerging Research
- Contact Module Engineering for Advanced CMOS Nodes
- Resonator Devices
- Neutron Spectroscopy of Light Ion Nuclear Reactions
President and CEO of Axcelis Technologies
For more information on the event, or to register, visit the conference website at https://www.iitvillach2026.com/
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry nearly 50 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.
CONTACTS:
Investor Relations Contact:
David Ryzhik
Senior Vice President and Interim CFO
Telephone: (978) 787-2352
Email: [email protected]
Press/Media Relations Contacts:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: [email protected]
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SOURCE Axcelis Technologies, Inc.
