MicroVision unit wins government chip design contract for photonics
MicroVision, Inc. (NASDAQ: MVIS) announced that its MicroVision Semiconductor subsidiary has been selected by a prime government contractor to design a custom semiconductor solution for an advanced photonics application.
The project involves designing a liquid crystal on silicon (LCoS) spatial light modulator chip. The work combines the prime contractor's expertise in polarization technology and photonics with MicroVision Semiconductor's analog and mixed-signal integrated circuit design capabilities. The prime contractor was not named in the announcement.
MicroVision Semiconductor is based in Colorado Springs, Colorado, and focuses on custom analog and mixed-signal integrated circuit development. The unit operates alongside MicroVision's core lidar and perception business, which serves industrial, security and defense, and automotive markets.
Glen DeVos, Chief Executive Officer of MicroVision, said in a statement: "This LCoS project is a strong example of that strategy in action. We are bringing highly specialized analog and mixed-signal design capabilities to a company at the forefront of photonics innovation, while building another avenue for MicroVision to generate value from the engineering expertise within our organization."
No financial terms of the engagement were disclosed.
