Qualcomm Technologies (NASDAQ: QCOM) announced a multi-generation collaboration with Amazon to develop customized silicon for large-scale AI data centers, with a focus on AI inference workloads.

The companies plan to work together on optical connectivity solutions, including high-bandwidth interconnects extending to 1.6 terabits and future-generation systems. The collaboration will draw on Qualcomm's SerDes and optical DSP technologies to support the bandwidth demands of AI infrastructure within Amazon data center networks.

As part of the arrangement, Qualcomm Technologies plans to expand its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation workloads, with the stated goal of reducing chip design cycle times.

"As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency," said Cristiano Amon, President and CEO of Qualcomm. "Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure."

Prasad Kalyanaraman, Vice President at AWS, said the collaboration is focused on "delivering more performant, efficient, and cost-effective infrastructure for our customers."

Financial terms of the agreement were not disclosed.