Qnity Electronics, Inc. (NYSE: Q) has introduced the Stackplane™ family of slurries for chemical mechanical planarization (CMP), targeting advanced semiconductor packaging applications, according to a company statement.

The Stackplane™ platform includes both commercialized products and next-generation slurry technologies designed to address multiple CMP steps required in advanced packaging, including planarization following hybrid bonding and through-silicon via (TSV) integration. The product line is organized into four series:

— SP1000 and SP2000 series for hybrid bonding
— SP3000 series for TSV applications
— SP4000 series for polymer CMP
— SP5000 series for emerging technologies, including panel-level through-glass vias and glass CMP

"Advanced packaging is creating new demands for precision, performance, and reliability across semiconductor manufacturing," said Kate Dei Cas, President of Semiconductor Technologies at Qnity. "Qnity already offers one of the industry's broadest portfolios for advanced packaging, and the new Stackplane™ slurry platform further builds on that capability."

Qnity plans to present the Stackplane™ platform at SEMICON Taiwan, Sept. 2–4, in Taipei, Taiwan, at booth S7930 in the Materials Pavilion. The company will also feature the platform at the International Conference on Planarization/CMP Technology, Oct. 19–22, in Seoul, South Korea.

The Wilmington, Delaware-based company said its experts can also recommend complementary CMP pads and post-CMP cleans as part of a broader advanced packaging portfolio.