GlobalFoundries and Silicon Labs expand partnership for wireless chips

GlobalFoundries (NASDAQ: GFS) and Silicon Labs (NASDAQ: SLAB) announced an expansion of their strategic partnership to develop wireless connectivity solutions at GlobalFoundries' facility in Malta, New York.

Under the expanded agreement, Silicon Labs will manufacture wireless system-on-chips using GlobalFoundries' new 40nm Ultra Low Power platform at the New York facility. The 40ULP-ESF3 platform incorporates embedded SuperFlash technology and features ultra-low standby leakage devices designed for battery-powered Internet of Things applications.

GlobalFoundries introduced the 40nm platform at its Global Technology Summit in Silicon Valley this fall. The company stated this represents the first introduction of this process technology in the United States.

"We're excited to deepen our strong partnership with GlobalFoundries to accelerate U.S.-based innovation in wireless connectivity," said Matt Johnson, President and CEO of Silicon Labs. The collaboration addresses demand for the company's Series 2 products.

Tim Breen, CEO of GlobalFoundries, said the partnership aims to deliver wireless connectivity solutions for consumer and industrial devices while supporting onshore semiconductor manufacturing.

The companies indicated the partnership targets growing demand in consumer and industrial IoT applications for wireless connectivity. Development is currently underway, with production expected to ramp over the next several years.

The announcement was made in a joint press release from the two companies.

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